Author: Fukuoka, S.
Paper Title Page
WEPAL016 Tensile Fracture Test of Metallic Wire of Beam Profile Monitors 2183
  • A. Miura, Y. Kawane, K. Moriya
    JAEA/J-PARC, Tokai-Mura, Naka-Gun, Ibaraki-Ken, Japan
  • S. Fukuoka
    Nihon Koshuha Co. Ltd, Yokohama, Japan
  • K. Futatsukawa, T. Miyao
    KEK, Ibaraki, Japan
  In order to mitigate the beam loss during a beam transportation in a high-brilliant accelerator facilities, wire-based profile monitors are used to measure by both transverse and longitudinal beam profiles using wire-scanner monitors (WSMs) and bunch-shape monitors (BSMs) for the tuning of quadrupole magnets and bunching cavities. Signals are come from the direct interaction between a metallic wire and beam. We have used the tungsten wire as a high melting-point material by estimation of heat loading during the impact of beam particles. In addition, a spring is applied for the relaxing a sag under wire's own weight. A tensile fracture test is conducted by supplying an electrical current as a simulated beam-heat loading. As the results, we obtained the relation between the thermal limit to break down and tension loading of tungsten wire.  
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